2024年4月20日
2024年4月8日
[20240408] TSMC Arizona與美國商務部宣布最高可達66億美元的晶片法案直接補助,該公司並計畫在鳳凰城設立第三座先進晶圓廠 / TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
TSMC Arizona與美國商務部宣布最高可達66億美元的晶片法案直接補助,該公司並計畫在鳳凰城設立第三座先進晶圓廠
第三座晶圓廠將生產美國最先進的尖端半導體,台積公司在亞利桑那州的總投資金額將超過650億美元
台灣積體電路製造股份有限公司今日(2024/04/08, 美國當地時間8日)宣布,美國商務部和TSMC Arizona已簽署一份不具約束力的初步備忘錄(preliminary memorandum of terms, PMT),基於《晶片與科學法》(CHIPS and Science Act),TSMC Arizona將獲得最高可達66億美元的直接補助。台積公司亦宣布計畫在TSMC Arizona設立第三座晶圓廠,以透過在美國最先進的半導體製程技術來滿足強勁的客戶需求。
台積公司在亞利桑那州的第一座晶圓廠於完工方面取得良好進展,第二座晶圓廠持續建設,隨著第三座晶圓廠的設立計畫將使台積公司在亞利桑那州鳳凰城據點的總資本支出超過650億美元,該據點為亞利桑那州史上規模最大的外國直接投資案,也是美國史上規模最大的外國在美直接綠地(greenfield)投資案。
台積公司董事長劉德音博士表示:「《晶片與科學法》為台積公司創造了機會,推動這項前所未有的投資,使我們能以在美國最先進的製造技術提供晶圓製造服務。台積公司在美國的營運讓我們能更好地協助我們的美國客戶,這其中包括了數間全球領先的科技公司。我們在美國的營運更將擴大我們的能力,以引領半導體技術的未來進步。」
台積公司總裁魏哲家博士表示:「我們很榮幸能夠支持那些身為行動裝置、人工智慧和高效能運算領域的先驅者,無論是在晶片設計、硬體系統或是軟體、演算法及大型語言模型的方面。他們是帶動最先進矽需求的創新者,而這些是台積公司所能提供的。作為他們的晶圓製造服務合作夥伴,我們將藉由提升TSMC Arizona在先進製程技術上的產能,來幫助他們釋放創新。我們對亞利桑那州晶圓廠迄今為止的進展感到欣喜,並將致力取得長期成功。」
TSMC Arizona的三座晶圓廠預計將創造約6,000個直接的高科技、高薪工作機會,打造有助於支持充滿活力和具有競爭力的全球半導體生態系統的勞動力,讓美國的領先企業能夠透過世界一流的半導體製造服務取得在美國在地製造的先進半導體產品。此外,根據大鳳凰城經濟發展促進會(Greater Phoenix Economic Council)的分析報告,針對這三座晶圓廠的增額投資將創造累計超過2萬個單次的建造工作機會,以及數以萬計的間接供應商和消費端累計的工作機會。
TSMC Arizona的第一座晶圓廠依進度將於2025年上半年開始生產4奈米製程技術;繼先前宣布的3奈米技術,第二座晶圓廠亦將生產世界上最先進、採用下一世代奈米片(Nanosheet)電晶體結構的2奈米製程技術,預計於2028年開始生產;第三座晶圓廠預計將在21世纪20年代底採用2奈米或更先進的製程技術進行晶片生產。與台積公司所有的先進晶圓廠相同,這三座晶圓廠的潔淨室面積都約是業界一般邏輯晶圓廠的兩倍大。
台積公司實踐綠色製造,旨在成為環境友善企業的全球標準,在能源效率、節水、廢物管理和空氣污染管控等方面不斷創新。TSMC Arizona的晶圓廠以相同的全球願景設計和建造,目標實現90%的水回收率;TSMC Arizona已就達到「近零液體排放」的目標進行工業用再生水廠的設計階段,讓幾乎每一滴水都能於廠內再被利用。
除了提出的66億美元直接補助,初步備忘錄(PMT)亦提議向台積公司提供最高可達50億美元的貸款。台積公司亦計劃向美國財政部就TSMC Arizona資本支出中符合條件的部分,申請最高可達25%的投資稅收抵免。台積公司維持其對長期財務目標的承諾,即營收以美元計的年複合成長率為15%至20%、毛利率達53%以上,且股東權益報酬率高於25%。
台積公司的所有海外投資皆須遵循台灣法規取得必要的核准。
來自我們客戶的引言(依公司名稱英文字母順序排列):
超微董事長暨執行長蘇姿丰表示:「今天的宣布,突顯了雷蒙多部長和美國政府為了確保美國在打造更具地域多樣性和彈性的半導體供應鏈中扮演重要角色,所做出的堅定承諾。台積電長久以來所提供的先進製造產能,讓超微能夠專注於我們最擅長的領域:設計改變世界的高效能晶片。我們致力於維持與台積電的合作夥伴關係,並期待在美國生產我們最先進的晶片。」
Apple執行長Tim Cook表示:「台積電處於先進半導體技術的領先位置,當這種專業知識與美國工作者的聰明才智相結合時,任何難以置信的事情都會變成可能。我們很榮幸能在台積電美國生產的拓展中發揮關鍵作用,我們將繼續在美國投資,支持美國先進製造的新時代。」
輝達創辦人暨執行長黃仁勳表示:「我們祝賀台積電的歷史性投資,並對商務部的支持給予喝采。自從輝達發明GPU和加速運算以來,台積電一直是我們的長期合作夥伴,如果沒有台積電,我們就不可能在人工智慧(AI)方面持續創新。我們很高興在台積電為亞利桑那州帶來其先進製造設施的同時,繼續與台積電合作。」
TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Third fab will produce the most advanced leading-edge semiconductors in the U.S., bringing TSMC’s total investment in Arizona to over US$65 Billion
PHOENIX, Arizona, Apr. 8, 2024 – TSMC (TWSE: 2330, NYSE: TSM) today announced that the U.S. Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and Science Act. TSMC also announced plans to build a third fab at TSMC Arizona to meet strong customer demand leveraging the most advanced semiconductor process technology in the United States.
As the company makes progress in completing its first fab and continues construction of its second fab at its Arizona subsidiary, the third fab brings TSMC’s total capital expenditure for the Phoenix, Arizona site to more than US$65 billion, making the site the largest foreign direct investment in Arizona history, and the largest foreign direct investments in a greenfield project in U.S. history.
“The CHIPS and Science Act provides TSMC the opportunity to make this unprecedented investment and to offer our foundry service of the most advanced manufacturing technologies in the United States,” said TSMC Chairman Dr. Mark Liu. “Our U.S. operations allow us to better support our U.S. customers, which include several of the world’s leading technology companies. Our U.S. operations will also expand our capability to trailblaze future advancements in semiconductor technology.”
“We are honored to support our customers who have been pioneers in mobile, artificial intelligence and high-performance computing, whether in chip design, hardware systems or software, algorithms, and large language models,” said TSMC CEO Dr. C.C. Wei. “They are the innovators driving demand for the most advanced silicon that TSMC can provide. As their foundry partner, we will help them unleash their innovations by increasing capacity for leading-edge technology through TSMC Arizona. We are thrilled by the progress of our Arizona site to date and are committed to its long-term success.”
TSMC Arizona’s three fabs are expected to create approximately 6,000 direct high-tech, high-wage jobs, building a workforce that will help to support a vibrant and competitive global semiconductor ecosystem that enables leading U.S. companies to gain access to domestically-manufactured, cutting-edge semiconductor products alongside a world-class semiconductor foundry. According to an analysis by the Greater Phoenix Economic Council, this increased investment in three fabs will create more than 20,000 accumulated unique construction jobs, and tens of thousands of indirect supplier and consumer jobs.
TSMC Arizona’s first fab is on track to begin production leveraging 4nm technology in first half of 2025. The second fab will produce the world’s most advanced 2nm process technology with next-generation nanosheet transistors in addition to the previously announced 3nm technology, with production beginning in 2028. The third fab will produce chips using 2nm or more advanced processes, with production beginning by the end of the decade. Each of the three fabs, like all of TSMC’s advanced fabs, will have cleanroom area approximately double the size of an industry standard logic fab.
TSMC practices green manufacturing and aims to serve as a global standard for eco-friendly corporations with constant innovations in energy efficiency, water conservation, waste management, and air pollution control. TSMC Arizona’s fabs are designed and built with that same global vision and aims to achieve a 90% water recycling rate. The company has started the design phase of building an industrial water reclamation plant with a design goal of achieving “near zero liquid discharge”, bringing nearly every drop of water back into the facility.
In addition to the proposed US$6.6 billion in direct funding, the PMT also proposes to provide TSMC with up to US$5 billion in loans. TSMC plans to apply for U.S. Treasury Department Investment Tax Credits of up to 25% of the qualified capital expenditure at TSMC Arizona. The company remains committed to its long-term financial goals, which are 15-20% revenue compound annual growth rate (CAGR) in USD terms, 53% and higher gross margin, and 25% and higher return on equity (ROE).
All TSMC overseas investment are subject to regulatory approvals in Taiwan as necessary.
Remarks from our customers:
“Today’s announcement highlights the strong commitment from Secretary Raimondo and the entire administration to ensure the U.S. plays a central role creating a more geographically diverse and resilient semiconductor supply chain,” said AMD Chair and CEO Lisa Su. “TSMC has a long track record of providing the leading-edge manufacturing capabilities that have enabled AMD to focus on what we do best, designing high-performance chips that change the world. We are committed to our partnership with TSMC and look forward to building our most advanced chips in U.S.”
“TSMC is at the leading edge of advanced semiconductor technology — and when that expertise is paired with the ingenuity of American workers, incredible things are possible,” said Apple CEO Tim Cook. “We are proud to play a key part in the expansion of TSMC’s U.S. production, and we’ll continue to invest in America and support a new era of American advanced manufacturing.”
“We congratulate TSMC for its historic investment and applaud the Commerce Department for its support. TSMC has been a long-standing partner of NVIDIA since we invented the GPU and accelerated computing, and our ongoing innovation in Artificial Intelligence (AI) would not have been possible without them. We are excited to continue our partnership with TSMC as it brings cutting-edge facilities to Arizona.”
Jensen Huang, founder and CEO of NVIDIA